Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET Corporation SA
Description
pulled from site's meta descriptionFor flip chip bonding, chip-to-chip bonding, chip-to-wafer and direct metallic bonding, SET offers flexible flip chip bonders and die bonders that can align and bond components with submicron post-bond accuracy.
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Categories:
- AboutUs AutoGen
- chip to chip bonding
- bonding
- chip bonding
- die bonder
- flip chip
- direct metallic bonding
- metallic bonding
- device bonder
- die bonders
- flip-chip bonder
- flip chip bonder
- bonder
- die bonding
- flip chip bonding
- fluxless eutectic bonding
- bonding process
- assembly
- packaging
- IR-FPA
- die stacking
- chip stacking
- 3D IC
- NIL
- FC150
- FC300
- FC300R
- LDP150
- NPS300
- 3D interconnect
- 3D integration
- optoelectronic bonding