SemiconEurope.com
Title
Mirror Semiconductor
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- Chip Packaging 2.0 means PC board designers use EDA software to re-map legacy chip package pinouts to arrive at the optimal point for PCB board design. Mirror Semiconductor offers Chip Packaging 2.0 solutions to supply the IC pinout you want without altering the performance of the die. UDPo is applicable with any pin count for QFN, QFP, TSOP, SOIC, BGA, CSP, flip chip, stacking and others. Chip Packaging 2.0 frees board designers to create optimum circuit boards with shorter copper tracings and fewer layers, quicker to market, at lower total cost. more info
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