EyeSquad.com sells and invests in micro-optic & miniaturization technologies
Title
TESSERA TECHNOLOGIES
Description
Excerpted from the website description:
- UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera produces and provides a broad range of advanced packaging solutions from stacked chip solutions to wafer level packaging.
Languages
English
Address
- 9 Shivtei Israel St.
- Raanana 43215 ISRAEL
Contact
- David Gasul
-
- +972 97460403
Additional Information
Related Domains
External Links
Categories:
- 3D Package
- 3D Packaging
- Advanced Packaging
- BGA
- Ball Grid Array
- Ball Stack
- CSP
- Chip Scale
- Chip Scale Package
- Chip Scale Technology
- Compliant Chip
- Compliant Layer
- DDR II
- Die Stack
- Die Stacking
- FBGA
- Fine Pitch BGA
- Fold-over
- Integrated Passives
- Land Grid Array
- MBGA
- MCP
- Memory Modules
- MicroZ Miniaturization
- Micro BGA
- Multi-chip
- Multi-chip Package
- Package Design
- Package Solutions
- Package Stacking
- Packaging
- Power Amplifier Module
- Pyxis
- RF Module
- SIP
- Semiconductor Packaging
- Stacked
- Stacking
- System In Package
- System Integration
- System Level Integration
- System Miniaturization
- Tessera
- Tessera Technologies
- Thermal Solutions
- UBGA
- WLP
- Wafer Level
- Wave