Esec.ch
Title
ESEC - Die attach and wire bonding solutions
Description
Unaxis Assembly & Packaging is a leading global provider of chip assembly equipment, processing techniques and system solutions for the semiconductor industry. Our machines and solutions are utilized in what is known as the backend segment of semiconductor production.
Unique know-how in the area of mechatronics, highly qualified employees, intensive cooperation with suppliers, and a global network of sales centers are the key factors of our success.
Headquartered in Cham (Switzerland), Unaxis Assembly & Packaging employs around 600 people and operates eight service centers in Europe, the USA, and key Asian markets.
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Additional Information
Related Domains
Categories:
- 300 Mm
- Adhesive Bonding
- Advanced Packaging
- Assembly Equipment
- Boc
- Back End
- Backend
- Ball Bumping
- Bga
- Bonder Ball Wire Wedge
- Bonding Equipment
- Bonding Tool
- Chip Assembly
- Chipscale
- Die Attach
- Die Bonder
- Drahtbonder
- Eutectic
- Fine Pitch
- Flip Chip
- Loc
- Mcm
- Mems
- Microelectronic Assembly
- Moems
- Offline Programming
- Qfn
- Rf Device
- Smart Card
- Soft Solder
- Stacked Die
- Thin Die
- Wire Bonder
- 300mm
- BOC
- Back-end
- Flipchip
- LOC
- QFN
- RF Device