DataCon.at

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Flip Chip, Die Bonder, Die Attach, CMOS image sensor - Datacon Austria, your partner for total packaging solutions - flip-chip, Die Bonding

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Datacon Technology GmbH is a specialist for Die Bonding ( die bonder), Die Attach, Flip Chip ( flip-chip ). It is concentrating on advanced packaging solutions. Our unique platform concept is the ideal system for various packages like SIP,MCM,BGA,COB, CMOS image sensor

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