Apmag.com sells electronic parts that they manufacture
Title
Advanced Packaging Magazine highlights IC packaging processes, wafer dicing, die placement and more
Description
Advanced Packaging serves those in operations that integrate electronic component packages into circuitry of their end products. Advanced Packaging magazine debuted in 1992 to the IC packaging engineering community.
Each issue of Advanced Packaging highlights an important step in the IC packaging process, including wafer dicing, die placement, die attach, wire bonding, encapsulation/molding, lead forming, solder bumping, package inspection, package test, and laser marking, singulation, packing and shipping. Each step implements the latest trends and technologies, and is written by a leading IC packaging expert in the given field.
Advanced Packaging's editorial topics include CSP, flip chip, MCM, BGA, Microwave/RF, thermal management, wafer-level packaging, system-on-a-chip, s oldering, wire bonding, direct chip attach, die placement, substrates, KGD, thick/thin film, inspection and test, adhesives and epoxies/underfill, environmental packaging, COB and TAB. Regular magazine departments focus on step-by-step advanced packaging, partners in manufacturing, market trends, feature products and event coverage.
Languages
English
Address
- 17730 W Peterson Rd Box 159
- Libertyville IL 60048 US
Contact
- IHS Publishing Group
-
- +1 918 835 3161, Fax: +1 918 831 9120
Additional Information
Related Domains
External Links
- Alexa: Apmag.com
